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Processing Equipment×電子技研 - List of Manufacturers, Suppliers, Companies and Products

Processing Equipment Product List

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Barrel-type plasma treatment device PB series

Barrel-type plasma treatment device PB series

Utilizing isotropic plasma, ideal for cleaning and modifying fine patterns and the inner surfaces of tube shapes!

The barrel-type plasma treatment device "PB Series" utilizes isotropic vacuum plasma for the removal of organic materials (Ashing), removal of oils (Cleaning), etching of silicon compounds (SiO2, SiN), and improvement of wettability, all without the use of solutions (Wet). It achieves a good environmental performance (clean working environment, no waste liquid) and low running costs. Treatment progresses from all directions, demonstrating the effects of nano-level processing, cleaning, and modification regardless of the shape of the target object. 【Device Features】 ■ Free processing that does not select sample shapes (cylindrical treatment chamber / isotropic plasma) ■ Diverse processes: Ashing (cleaning), Etching, surface modification, etc. ■ All parts are compatible with clean room standards (can be used as semiconductor manufacturing equipment) ■ Cost-effective, small footprint design ■ Safety specifications suitable for use as a mass production device For more details, please contact us or download the catalog.

  • Plasma surface treatment equipment

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Roll-to-roll type vacuum plasma treatment device 'PR Series'

Roll-to-roll type vacuum plasma treatment device 'PR Series'

Compatible with the processing of roll-type film substrates. Through vacuum plasma treatment, in addition to ashing and etching, surface modification treatment (functional group addition) is possible.

The "PR Series" is a roll-to-roll processing device capable of plasma treatment under reduced pressure. It can firmly impart various functional groups (such as hydrophilic, lipophilic, adhesion improvement, etc.) to the surface of substrates, starting with resist ashing and insulating film etching, depending on the application. We have a demo unit at our headquarters and are accepting process evaluation treatments at any time. Please contact us for more details. 【Features】 ■ Roll-to-roll type ■ Plasma treatment under reduced pressure - Higher organic removal and surface modification effects compared to atmospheric pressure devices - Capable of processes that were not possible with atmospheric pressure devices (such as various functional group modifications) *For more details, please refer to the PDF materials or feel free to contact us.

  • Plasma surface treatment equipment
  • Vacuum Equipment
  • Other surface treatment equipment

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Vacuum device for substrate parallel plate plasma processing equipment PC-RIE series

Vacuum device for substrate parallel plate plasma processing equipment PC-RIE series

Processable substrate size 550×650 mm. Achieves zero waste liquid and low running costs.

The "PC-RIE series" can perform processing such as ashing, desmearing, surface modification, and F-type gas etching for medium-sized LCD substrates, printed circuit boards, and more. Customers can choose a version that suits their needs, ranging from a manually operated research and development type chamber to a fully automated system with an atmospheric gate, transport mechanism, and cassette station. 【Features】 ○ Vacuum plasma technology provides a better environment compared to conventional processing → Cleaning, no waste liquid ○ Low running costs ○ Usable substrate size: 550×650 mm For more details, please download the catalog or contact us.

  • Plasma surface treatment equipment
  • Vacuum Equipment

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Vacuum device for plasma treatment for parallel plate evaluation

Vacuum device for plasma treatment for parallel plate evaluation

Widely used in fine anisotropic processing such as semiconductor, liquid crystal fine patterning, and DNA chip manufacturing.

You can choose a version that suits your needs, ranging from a manually operated research and development type chamber with atmospheric gates, transport mechanisms, and cassette stations to a fully automated system. We emphasize process reproducibility and standardly equip our systems with chillers for electrode temperature control and APC, and we can add turbo pumps compatible with high vacuum processes. 【Features】 ○ RIE plasma etching equipment ○ Capable of anisotropic etching of silicon wafers up to 6 inches and small square substrates ○ Equipment for 8 and 12 inches can also be designed For more details, please download the catalog or contact us.

  • Plasma surface treatment equipment
  • Vacuum Equipment

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No need to choose sample shapes, process freely! Barrel-type plasma treatment device.

No need to choose sample shapes, process freely! Barrel-type plasma treatment device.

Cleaning and modification of fine patterns and the inner surfaces of tube shapes are possible! Cleaning and modification can be done without using solutions, achieving good environmental performance and low running costs.

The barrel-type plasma treatment device "PB Series" utilizes isotropic vacuum plasma for the removal of organic materials (Ashing), removal of oil (Cleaning), etching of silicon compounds (SiO2, SiN), and improvement of wettability, all without the use of solutions (Wet). It achieves a good environmental performance (clean working environment, no waste liquid) and low running costs. Treatment progresses from all directions, demonstrating effects of nano-level processing, cleaning, and modification regardless of the shape of the target object. 【Device Features】 ■ Free processing that does not select sample shapes (cylindrical processing chamber / isotropic plasma) ■ Diverse processes: Ashing (cleaning), Etching, surface modification, etc. ■ All parts are compatible with clean room standards (can be used as semiconductor manufacturing equipment) ■ Cost-effective, small footprint design ■ Safe specifications suitable for mass production equipment For more details, please contact us or download the catalog.

  • Plasma surface treatment equipment

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Atmospheric pressure plasma treatment device

Atmospheric pressure plasma treatment device

Achieving contamination-free and clean plasma reforming.

<Features> ● Since plasma is generated inside a quartz glass tube, impurities such as particles do not fall onto the treated object, allowing for clean plasma treatment. ● The plasma generation unit has few consumable parts, and with regular maintenance, it can achieve a long lifespan of over 10,000 hours. ● Plasma treatment can be performed at atmospheric pressure, eliminating the need for a vacuum system and reducing capital investment. ● This device is divided into a plasma generation unit and a controller unit, allowing for easy integration of just the plasma generation unit into your existing or new equipment to build an inline system. ● It can perform pinpoint high-speed plasma treatment on targeted areas. ● It comes standard with input/output control functions for customer-side equipment, enabling control of plasma irradiation ON/OFF based on signals from the customer-side equipment.

  • Other semiconductor manufacturing equipment

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